***********************************************************************
***********           PANJIT International Inc.             ***********
***********************************************************************
*Mar 21, 2025                                                         *
*                                                                     *
*This SPICE Model describes the characteristics of a typical device   *
*and does not respresent the specification. Designer should refer to  *
*the same type name data sheet for specification limits.              *
***********************************************************************
*$
.subckt P6SMB300A  A K 
.param
+vc0 = 1.046e-9		vc1 = 3.016e-10		vc2 = 1.000e0		vc3 = 9.713e-10		vc4 = 1.425e-2
+tc1 = 4.808e-2		tc2 = 3.405e-2		tc3 = 2.508e-2		tc4 = 3.655e-2		   
.func irexp(v) {(vc0+vc1*v**vc2)*(1.0+tc1*(temp-25)*exp(tc2*(temp-25)))+(vc3*exp(vc4*v))*(1.0+tc3*(temp-25)*exp(tc4*(temp-25)))}
.func rbv(i) (5.228e+1*min(i,0)}
d1 A A1 zener
g1 A1 A value = {irexp(v(A1,A))}
v1 A1 K1 0
e1 K1 K value = {rbv(i(v1))}
.model zener d
***** flag parameter *****
+level = 1 
***** dc model parameter *****
+ is = 4.069e-9	       n = 1.655          rs = 1.284e-2
+ibv = 1.0e-3		 nbv = 1.000	  bv = 300.00
+ikf = 3.0e-1
***** capacitance parameter *****
+cjo = 2.348e-10	   m = 3.837e-1		  vj = 5.916e-1
+ fc = 0.5
***** temperature coefficient *****
+tnom = 25		      eg = 1.080		      xti = 3
+trs1 = 1.046e-4	      trs2 = 1.533e-5        tikf= 5.455e-3        
+tbv1 = 1.207e-3	      tbv2 = -2.074e-6
.ends P6SMB300A
*$
